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Package Version Package Name Package Description Reference Codes Issue Date
OL-74AUP1T97UK WLCSP wafer level chip-scale package; 6 bumps; 0.65 x 0.44 x 0.27 mm 2015-05-06
OL-BGU8004 WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2013-11-04
OL-BGU8006 WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2012-07-25
OL-BGU8H1UK WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
OL-BGU8L1UK WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
OL-BGU8M1UK WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
OL-IP3047CX6 WLCSP Wafer level chip-size package; 6 bumps (3 x 2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3048CX5 WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3053CX10 WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3053CX15 WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3053CX20 WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3053CX5 WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3088CX10 WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3088CX15 WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3088CX20 WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3088CX5 WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3319CX6 WLCSP Wafer level chip-size package; 6 bumps (2 x 3) 2013-06-11
OL-IP3337CX18 WLCSP Wafer level chip-size package; 18 bumps 2011-07-06
OL-IP3338CX24 WLCSP Wafer level chip-size package; 24 bumps 2011-07-06
OL-IP3348CX10 WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC 2011-06-06
OL-IP3348CX15 WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC 2011-07-06
OL-IP3348CX20 WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC 2011-06-07
OL-IP3348CX5 WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC 2011-06-07
OL-IP4035CX24 WLCSP Wafer level chip-size package; 24 bumps (5 x 5 - A1) ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
OL-IP4041CX25 WLCSP Wafer level chip-size package; 25 bumps (5 x 5) ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
OL-IP4051CX11 WLCSP Wafer level chip-size package; 11 bumps; 1.96 x 1.44 x 0.70 mm 2005-08-26
OL-IP4052CX20 WLCSP Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.70 mm 2008-11-11
OL-IP4060CX16 WLCSP wafer level chip-size package; 16 bumps 2009-03-12
OL-IP4064CX8 WLCSP Wafer level chip-size package; 8 bumps; 1.41 x 1.41 x 0.7 mm 2010-11-02
OL-IP4067CX9 WLCSP Wafer level chip-size package; 5 bumps; 1.46 x 1.52 x 0.70 mm 2011-04-28
OL-IP4080CX20 WLCSP Wafer level chip-size package; 20 bumps; 2.51 x 2.01 x 0.70 mm 2008-11-11
OL-IP4085CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.91 x 0.91 x 0.70 mm 2011-06-06
OL-IP4302CX2 WLCSP Wafer level chip-size package; 2 bumps; 0.52 x 0.72 x 0.42 mm 2008-05-20
OL-IP4309CX9 WLCSP Wafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm 2008-09-24
OL-IP4332CX5 WLCSP Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm 2011-04-28
OL-IP4337CX18 WLCSP WLCSP18: wafer level chip-size package; 18 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
OL-IP4338CX24 WLCSP WLCSP24: wafer level chip-size package; 24 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
OL-IP4342CX5 WLCSP Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm 2008-08-15
OL-IP4343CX5_LF WLCSP Wafer level chip-size package; 5 bumps; 0.93 x 0.93 x 0.66 mm 2011-07-18
OL-IP4350CX24 WLCSP Wafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm 2011-06-06
OL-IP4352CX24 WLCSP Wafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm 2009-07-06
OL-IP4358CX6 WLCSP Wafer level chip-size package; 6 bumps; 1.16 x 0.76 x 0.68 mm 2008-10-10
OL-IP4359CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
OL-IP4365CX11 WLCSP Wafer level chip-size package; 11 bumps 2011-07-06
OL-IP4366CX8 WLCSP Wafer level chip-size package; 8 bumps (3 x 3 - A1) 2011-07-06
OL-IP4385CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2007-09-03
OL-IP4386CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
OL-IP4387CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
OL-IP4852CX25 WLCSP Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm 2006-09-23
OL-IP4855CX25 WLCSP Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm 2013-04-15
OL-LD6938 WLCSP Wafer level chip-size package; 6 bumps (2 x 3) 2013-06-11
OL-LPC1102UK WLCSP Wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC 2010-10-18
OL-LPC1768UK WLCSP WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm ---(EIAJ);---(JEDEC);---(IEC 2013-11-04
OL-LPC5410 WLCSP wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) 2014-11-03
OL-NCX8200UK WLCSP wafer chip-scale package; 9 bumps; 1.22 x 1.22 x 0.5 mm 2014-12-16
OL-NTB0104UK WLCSP wafer level chip-size package, 12 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-06-16
OL-NTS0104UK WLCSP wafer level chip-size package, 12 bumps 2011-07-28
OL-NVT4555UK WLCSP wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm ---(EIAJ);---(JEDEC);---(IEC 2013-02-26
OL-NVT4556UK WLCSP wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.205 mm x 1.605 mm x 0.272 mm body 2014-04-22
OL-NVT4857 WLCSP wafer level chip-scale package; 20 bumps; 2.1 x 1.7 x 0.49 mm (Backside coating included) 2015-07-21
OL-NX18P3001UK WLCSP wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-05-23
OL-NX1A4WP WLCSP wafer level chip-scale package; 42 bumps; 3.56 x 3.41 x 0.57 mm (backside coating included) 2015-01-19
OL-NX20P3000UK WLCSP wafer level chip-size package; 16 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-11-04
OL-NX3DV1066 WLCSP wafer level chip-size package; 16 bumps 2012-01-10
OL-NX3P1107 WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
OL-NX3P1107UK WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
OL-NX3P1108 WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
OL-NX3P1108UK WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
OL-NX3P190 WLCSP wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) ---(EIAJ);---(JEDEC);---(IEC 2011-06-09
OL-NX3P190UK WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
OL-NX3P191 WLCSP Wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) ---(EIAJ);---(JEDEC);---(IEC 2011-06-10
OL-NX3P191UK WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC 2012-07-02
OL-NX3P2902B WLCSP wafer level chip-scale package; 4 bumps; 0.77 x 0.77 x 0.51 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC 2013-04-02
OL-NX5P1000 WLCSP WLCSP12: wafer level chip-scale package; 12 bumps 2013-03-29
OL-NX5P1100 WLCSP WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-12-20
OL-NX5P2090UK WLCSP Wafer level chip-size package; 9 bumps 2013-03-27
OL-NX5P2190 WLCSP wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included) 2014-02-14
OL-NX5P2924B WLCSP wafer level chip-scale package; 6 bumps; 0.87 x 1.37 x 0.50 mm 2014-01-21
OL-NX5P2924C WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2015-04-21
OL-NX5P2924C_NX5P2924D_NX5P2925C WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2014-10-16
OL-NX5P2925C WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2015-04-21
OL-NX5P3001 WLCSP wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-05-23
OL-NXH5104UK WLCSP wafer level chip-scale package; 13 bumps; 2.74 x 2.80 x 0.38 mm 2015-10-05
OL-PCA9410 WLCSP wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2015-07-23
OL-PCA9411 WLCSP wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2015-09-29
OL-PCF2003DUS WLCSP wafer level chip-scale package; 8 bumps; 1.16 x 0.86 x 0.48 mm 2015-08-17
OL-PCT2202 WLCSP wafer level chip-scale package; 6 bumps; 0.69 x 1.09 x 0.38 mm (Backside coating included) 2014-11-19
OL-PEMI4CSP_RT WLCSP Wafer level chip-size package; 10 bumps (4-2-4) 2011-07-06
OL-PEMI4CSP_RW WLCSP Wafer level chip-size package; 10 bumps (4-2-4) 2011-07-06
OL-PEMI6CSP_RT WLCSP Wafer level chip-size package; 15 bumps (6-3-6) 2011-07-06
OL-PEMI6CSP_RW WLCSP Wafer level chip-size package; 15 bumps (6-3-6) 2011-07-06
OL-PEMI8CSP_RT_P WLCSP Wafer level chip-size package; 20 bumps (8-4-8) 2011-07-06
OL-PEMI8CSP_RW_P WLCSP Wafer level chip-size package; 20 bumps (8-4-8) 2011-07-06
OL-PMCM4401UPE WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2016-06-28
OL-PMCM440VNE WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2014-07-02
OL-PMCM440VPE WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2014-07-03
OL-PMCM6501VNE WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-07-07
OL-PMCM6501VPE WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-07-20
OL-PMCM650VNE WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-03-25
OL-PN548 WLCSP wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) 2015-08-06
OL-PN549 WLCSP wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) 2015-08-06
OL-PN550 WLCSP wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) 2015-08-06
OL-SA58635UK WLCSP Wafer level chip-size package; 16 balls; 1.7 x 1.7 x 0.56 mm 2010-01-19
OL-SA58671UK WLCSP Wafer level chip-size package; 16 balls; 2.06 x 2.11 x 0.6 mm 2007-10-17
OL-SA58672UK WLCSP Wafer level chip-size package; 9 bumps; 1.66 X 1.71 X 0.6 mm 2008-06-12
OL-TDA1308AUK WLCSP Wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm 2006-12-15
OL-TFA9860 WLCSP wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm ---(EIAJ);---(JEDEC);---(IEC 2013-03-07
OL-TFA9881UK WLCSP Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm 2010-10-06
OL-TFA9882UK WLCSP WLCSP9: wafer level chip-size package; 9 bumps ---(EIAJ);---(JEDEC);---(IEC 2011-05-26
OL-TFA9897 WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2014-10-09
OL-TFA9897A WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2015-04-17
OL-TFA9897B WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (backside coating included) 2015-03-13
OL-TFA9897C WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating include) 2015-05-07
OL-TFA9981UK WLCSP Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm 2010-10-25
PCA9412 WLCSP9 wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2016-08-04
SOT1375-4 WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 1.03 mm x 0.94 mm x 0.5 mm body 2016-04-26
SOT1375-5 WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 1.31 mm x 0.94 mm x 0.5 mm body 2018-11-30
SOT1375-6 WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 0.4 mm pitch, 0.91 mm x 0.855 mm x 0.455 mm body (backside coating included) 2022-07-15
SOT1376-2 WLCSP4 WLCSP4, wafer level chip-scale package; 4 bumps; 0.97 mm x 0.97 mm x 0.54 mm body (backside coating included) 2017-08-22
SOT1379-3 WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.22 mm pitch, 0.66 mm x 0.45 mm x 0.23 mm body 2018-11-20
SOT1379-4 WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.22 mm pitch, 0.66 mm x 0.45 mm x 0.28 mm body 2019-06-24
SOT1380-1 WLCSP6 wafer level chip-scale package; 6 bumps; 0.69 mm x 1.09 mm x 0.38 mm 2016-11-24
SOT1380-5 WLCSP6 WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.22 mm x 0.85 mm x 0.6 mm body 2017-06-11
SOT1380-6 WLCSP6 WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.18 mm x 0.84 mm x 0.455 mm body (backside coating included) 2020-12-04
SOT1381-2 WLCSP6 WLCSP6, wafer level chip-size package; 6 terminals; 0.5 mm pitch; 1.39 mm x 0.89 mm x 0.465 mm body 2021-12-06
SOT1384-4 WLCSP9 WLCSP9, wafer level chip-scale package; 9 bumps; 1.50 mm x 1.28 mm x 0.60 mm body 2017-03-03
SOT1384-5 WLCSP9 wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included) 2018-08-08
SOT1385-2 WLCSP9 WLCSP9, wafer level chip-scale package; 9 bumps; 0.5 mm pitch, 1.49 mm x 1.49 mm x 0.555 mm body (backside coating included) 2018-03-06
SOT1390-1 WLCSP12 WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.36 mm x 1.66 mm x 0.51 mm body (backside coating included) 2017-09-09
SOT1390-10 WLCSP12 WLCSP12, wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.97 mm x 1.42 mm x 0.525 mm body 2018-06-19
SOT1390-12 WLCSP12 WLCSP12, wafer level chip-size package, 12 terminals, 0.4 mm pitch, 1.62 mm x 1.19 mm x 0.56 mm body 2022-07-04
SOT1390-5 WLCSP12 wafer level chip-scale package, 12 bumps 2016-03-02
SOT1390-6 WLCSP12 WLCSP12, wafer level chip-scale package; 12 bumps; 1.62 mm x 1.43 mm x 0.525 mm (backside coating included) 2017-01-11
SOT1390-7 WLCSP12 WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm (backside coating included) 2017-04-24
SOT1390-8 WLCSP12 WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.65 mm x 1.25 mm x 0.525 mm body (backside coating included) 2017-10-23
SOT1392-1 WLCSP wafer level chip-scale package; 15 bumps; 2.56 x 1.54 x 0.555 mm (Backside coating included) 2015-08-11
SOT1393-2 WLCSP16 WLCSP16, wafer level chip-scale package; 16 bumps; 1.84 mm x 1.84 mm x 0.5 mm body 2018-02-09
SOT1394-2 WLCSP16 wafer level chip-scale package; 16 bumps; 2.05 x 2.05 x 0.555 mm (Backside coating included) 2016-08-29
SOT1394-3 WLCSP16 WLCSP16, wafer level chip-scale package, 16 bumps, 2.20 mm x 2.20 mm x 0.555 mm body (backside coating included) 2018-03-12
SOT1397-10 WLCSP20 WLCSP20, wafer level chip-size package, 20 terminals, 0.4 mm pitch, 2.1 mm x 1.7 mm x 0.49 mm body (backside coating included) 2022-07-07
SOT1397-2 WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.56 mm body NON-JEDEC(JEDEC 2017-06-11
SOT1397-3 WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 1.94 mm x 1.99 mm x 0.6 mm body 2017-06-11
SOT1397-4 WLCSP20 wafer level chip-scale package, 20 bumps 2016-04-26
SOT1397-5 WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.32 mm body 2017-06-11
SOT1397-6 WLCSP20 WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included) 2017-01-19
SOT1397-7 WLCSP25 WLCSP25, wafer level chip-scale package; 25 bumps; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body 2017-12-04
SOT1397-8 WLCSP20 WLCSP20, wafer level chip-scale package; 20 bumps; 0.4 mm pitch, 2.50 mm x 1.84 mm x 0.5 mm body 2018-05-24
SOT1399-1 WLCSP24 WLCSP24, wafer level chip-scale package; 24 bumps; 2.98 mm x 1.90 mm x 0.525 mm body (backside coating included) 2017-06-22
SOT1401-1 WLCSP25 wafer level chip-scale package, 25 balls; 2.51 mm x 2.51 mm x 0.5 mm body 2015-10-05
SOT1401-2 WLCSP25 WLCSP25, wafer level chip-scale package, 25 bumps, 2.27 mm x 2.17 mm x 0.62 mm 2017-05-12
SOT1401-3 WLCSP25 WLCSP25, wafer level chip-scale package, 25 bumps, 2.555 mm x 2.525 mm x 0.368 mm body (backside coating included) 2017-05-12
SOT1401-4 WLCSP25 wafer level chip-scale package, 25 balls; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body 2018-08-03
SOT1403-1 WLCSP34 wafer level chip-scale package, 34 bumps, 0.4 mm pitch, 2.45 mm x 2.87 mm x 0.38 mm body 2016-08-08
SOT1404-2 WLCSP36 WLCSP36, wafer level chip-size package; 36 terminals; 0.35 mm pitch; 2.46 mm x 2.37 mm x 0.56 mm body 2017-06-11
SOT1404-3 WLCSP36 wafer level chip-scale package; 36 bumps; 2.07 mm x 2.07 mm x 0.42 mm body 2016-04-26
SOT1411-1 WLCSP12 WLCSP12, wafer level chip scape package, 12 terminals, 1.58 mm x 2.15 mm x 0.22 mm body 2010-09-27
SOT1425-1 WLCSP9 WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.22 mm body 2013-07-16
SOT1425-2 WLCSP9 WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.17 mm body 2013-07-16
SOT1440-2 WLCSP49 WLCSP49, wafer level chip-size package; 49 terminals; 0.054 mm pitch; 3.14 mm x 2.92 mm x 0.56 mm body 2017-06-11
SOT1443-2 WLCSP wafer level chip-scale package; 30 bumps; 2.26 x 2.56 x 0.51 mm (backside coating included) 2015-06-11
SOT1443-3 WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating included) 2016-04-26
SOT1443-6 WLCSP30 wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.5 mm body (backside coating included) 2019-04-26
SOT1443-7 WLCSP30 wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.525 mm body (backside coating included) 2019-04-16
SOT1444-10 WLCSP WLCSP49, wafer level chip-scale package; 49 bumps; 2.97 mm x 3.37 mm x 0.56 mm (backside coating included) 2017-01-06
SOT1444-11 WLCSP49 WLCSP49, wafer level chip-scale package; 49 bumps; 3.3 mm x 3.3 mm x 0.525 mm body (Backside coating included) 2018-08-22
SOT1444-12 WLCSP49 WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 2.915 mm x 3.142 mm x 0.564 mm body 2018-04-20
SOT1444-13 WLCSP49 WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 3 mm x 2.9 mm x 0.525 mm body (backside coating included) 2021-12-23
SOT1444-3 WLCSP wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm 2015-07-21
SOT1444-4 WLCSP wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm (Backside coating included) 2015-07-21
SOT1444-5 WLCSP49 WLCSP49, wafer level chip-scale package; 49 bumps; 3.44 mm x 3.44 mm x 0.525 mm (Backside coating included) 2016-04-26
SOT1444-6 WLCSP wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.5 mm 2016-04-26
SOT1444-7 WLCSP wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.525 mm 2016-04-26
SOT1444-8 WLCSP49 wafer level chip-scale package; 49 bumps; 3.13 x 3.63 x 0.5 mm 2016-08-09
SOT1444-9 WLCSP wafer level chip-scale package; 49 bumps; 3.19 mm x 3.19 mm x 0.49 mm 2016-04-26
SOT1445-1 WLCSP wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm 2016-07-11
SOT1445-2 WLCSP wafer level chip-scale package; 6 bumps; 0.69 mm x 0.44 mm x 0.29 mm 2016-12-06
SOT1445-3 WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.25 mm pitch, 0.7 mm x 0.45 mm x 0.23 mm body 2018-08-23
SOT1447-1 WLCSP99 wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.5 mm 2015-06-26
SOT1447-2 WLCSP wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.525 mm (Backside coating included) 2015-10-09
SOT1448-1 WLCSP29 WLCSP29, wafer level chip-size package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm body 2017-06-14
SOT1448-2 WLCSP WLCSP29, wafer level chip-scale package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm (backside coating included) 2017-01-11
SOT1450-2 WLCSP100 WLCSP100, wafer level chip-scale package; 100 bumps; 5.07 mm x 5.07 mm x 0.53 mm body 2018-03-06
SOT1452-1 WLCSP11 wafer level chip-scale package, 11 bumps 2016-03-02
SOT1453-1 WLCSP8 wafer level chip-scale package, 8 bumps 2016-03-02
SOT1454-1 WLCSP6 wafer level chip-scale package, 6 bumps 2016-03-02
SOT1455-1 WLCSP8 WLCSP8, wafer level chip-scale package; 8 bumps, 0.28 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body 2015-08-17
SOT1459-1 WLCSP42 wafer level chip-scale package; 42 bumps; 2.88 mm x 2.80 mm x 0.54 mm (Backside coating included) 2016-09-01
SOT1459-2 WLCSP wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.5 mm (backside coating included) 2016-04-26
SOT1459-3 WLCSP wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.525 mm 2016-04-26
SOT1459-6 WLCSP WLCSP42, wafer level chip-scale package; 42 bumps; 2.91 mm x 2.51 mm x 0.525 mm body (backside coating included) 2017-07-28
SOT1459-7 WLCSP42 WLCSP42, wafer level chip scale package, 42 terminals, 0.4 mm pitch, 2.86 mm x 2.46 mm x 0.525 mm body (backside coating included) 2020-05-13
SOT1459-8 WLCSP42 WLCSP42, wafer level chip scale package, 42 terminals, 0.4 mm pitch, 3.02 mm x 2.72 mm x 0.525 mm body (backside coating included) 2020-12-03
SOT1461-1 WLCSP WLCSP13, wafer level chip-size package; 13 bumps, 0.4 mm pitch, 2.74 mm x 2.80 mm x 0.38 mm body 2016-08-08
SOT1461-2 WLCSP WLCSP13, wafer level chip-scale package; 13 bumps; 1.19 mm x 1.99 mm x 0.5 mm body 2017-02-23
SOT1463-1 WLCSP wafer level chip-scale package, 46 bumps 2016-03-02
SOT1464-1 WLCSP6 WLCSP6, wafer level chip-scale package, 6 bumps, 0.19 mm pitch, 0.57 mm x 0.43 mm x 0.28 mm body 2016-04-25
SOT1465-1 WLCSP31 wafer level chip-scale package, 31 bumps 2016-04-26
SOT1465-2 WLCSP31 wafer level chip-scale package, 31 bumps 2016-03-02
SOT1774-1 WLCSP120 WLCSP120, wafer level chip-size package; 120 terminals; 0.4 mm pitch; 5.28 mm x 5.29 mm x 0.6 mm body NON-JEDEC(JEDEC 2017-06-11
SOT1775-1 WLCSP142 WLCSP142, , wafer level chip-size package; 142 terminals; 0.4 mm pitch; 5.58 mm x 4.84 mm x 0.6 mm body 2017-06-11
SOT1776-1 WLCSP143 WLCSP143, , wafer level chip-size package; 143 terminals; 0.4 mm pitch; 5.55 mm x 6.44 mm x 0.6 mm body 2017-06-11
SOT1777-1 WLCSP169 WLCSP169, wafer level chip-size package; 169 terminals; 0.4 mm pitch; 5.5 mm x 5.63 mm x 0.6 mm body 2017-06-11
SOT1778-1 WLCSP173 WLCSP173, wafer level chip-size package; 173 terminals; 0.5 mm pitch; 7.74 mm x 7.9 mm x 0.6 mm body 2017-06-11
SOT1779-1 WLCSP211 WLCSP211, , wafer level chip-size package; 211 terminals; 0.5 mm pitch; 9.33 mm x 7.91 mm x 0.6 mm body 2017-06-11
SOT1780-1 WLCSP36 WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.98 mm x 3.07 mm x 0.6 mm body 2017-06-11
SOT1780-10 WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body (backside coating included) 2018-11-01
SOT1780-11 WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) 2018-11-30
SOT1780-12 WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body 2018-12-04
SOT1780-13 WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.79 mm x 2.59 mm x 0.525 mm body 2019-04-18
SOT1780-2 WLCSP36 WLCSP36, wafer level chip-size package; 36 terminals; 0.4 mm pitch; 3.064 mm x 3.064 mm x 0.545 mm body 2016-01-05
SOT1780-3 WLCSP36 WLCSP36, wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.674 mm x 2.822 mm x 0.564 mm body 2016-04-15
SOT1780-4 WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body (backside coating included) 2017-12-20
SOT1780-5 WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body 2017-12-08
SOT1780-6 WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body 2017-09-18
SOT1780-7 WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body 2017-09-18
SOT1780-8 WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 3.9 mm x 1.9 mm x 0.525 mm body (backside coating included) 2018-06-20
SOT1780-9 WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) 2018-11-01
SOT1781-1 WLCSP35 WLCSP35, , wafer level chip-size package; 35 terminals; 0.4 mm pitch; 2.99 mm x 2.53 mm x 0.6 mm body 2017-06-11
SOT1781-2 WLCSP35 WLCSP35, wafer level chip-size package; 35 terminals; 0.4 mm pitch; 3 mm x 2.16 mm x 0.525 mm body 2021-11-23
SOT1782-1 WLCSP64 WLCSP64, , wafer level chip-size package; 64 terminals; 0.4 mm pitch; 3.32 mm x 3.35 mm x 0.6 mm body 2017-06-11
SOT1782-2 WLCSP64 WLCSP64, , wafer level chip-size package; 64 terminals; 0.4 mm pitch; 3.38 mm x 3.48 mm x 0.32 mm body 2017-06-11
SOT1782-3 WLCSP64 WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625 mm body (backside coating included) 2018-08-02
SOT1783-1 WLCSP80 WLCSP80, wafer level chip-size package; 80 terminals; 0.4 mm pitch; 3.56 mm x 4.13 mm x 0.6 mm body 2017-06-11
SOT1783-2 WLCSP80 WLCSP80, wafer level chip-size package; 80 terminals; 0.4 mm pitch; 3.56 mm x 4.13 mm x 0.34 mm body NON-JEDEC(JEDEC 2017-06-11
SOT1784-1 WLCSP89 wafer level chip-scale package, 89 bumps, 0.4 mm pitch, 3.63 mm x 3.58 mm x 0.38 mm body 2016-09-05
SOT1833-1 WLCSP75 WLCSP75, wafer level chip-size package; 75 terminals; 0.4 mm pitch; 3.8 mm x 3.89 mm x 0.56 mm body 2017-06-11
SOT1835-1 WLCSP25 wafer level chip-scale package, 25 bumps 2016-04-26
SOT1855-1 WLCSP wafer level chip-scale package; 29 bumps; 1.14 x 1.14 x 0.28 mm 2016-10-04
SOT1870-1 WLCSP8 Bumped die with 8 functional bumps; 2.51 mm x 2.51 mm x 0.16 mm 2016-10-04
SOT1872-1 WLCSP7 WLCSP7, , wafer level chip-size package; 7 terminals; 0 mm pitch; 0.38 mm x 1.47 mm x 0.38 mm body 2017-06-11
SOT1875-1 WLCSP210 WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.33 mm x 6.62 mm x 0.56 mm body 2017-06-11
SOT1875-2 WLCSP210 WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.94 mm x 6.94 mm x 0.56 mm body 2017-06-11
SOT1882-1 WLCSP47 wafer level chip-scale package; 47 bumps; 3.20 mm x 3.28 mm x 0.365 mm body 2016-08-01
SOT1887-1 WLCSP48 wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm (Backside coating included) 2016-10-04
SOT1887-2 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.5 mm body 2017-12-11
SOT1887-3 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 2017-12-11
SOT1887-4 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.50 mm body 2017-12-19
SOT1887-5 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 2017-12-08
SOT1890-1 WLCSP56 wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x 2.59 mm x 0.415 mm body (backside coating included) 2016-08-09
SOT1890-3 WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.95 mm x 2.6 mm x 0.415 mm body (backside coating included) 2019-01-23
SOT1901-1 WLCSP8 WLCSP8, wafer level chip-scale package; 8 bumps; 0.810 mm x 0.505 mm x 0.23 mm body 2017-03-08
SOT1906-2 WLCSP214 WLCSP214, wafer level chip-scale package, 214 terminals, 0.5 mm pitch, 9.418 mm x 7.918 mm x 0.55 mm body 2018-03-28
SOT1914-1 WLCSP56 WLCSP56, wafer level chip scale package, 56 terminals, 0.4 mm pitch, 4.39 mm x 3.59 mm x 0.5 mm body 2018-02-08
SOT1914-2 WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 3.455 mm x 3.06 mm x 0.495 mm body (backside coating included) 2020-04-06
SOT1914-3 WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 3.455 mm x 3.06 mm x 0.365 mm body (backside coating included) 2019-09-17
SOT1917-1 WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 2.99 mm x 3.54 mm x 0.355 mm body 2018-01-22
SOT1917-2 WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body 2017-02-21
SOT1917-3 WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 3.54 mm x 2.99 mm x 0.49 mm body 2018-04-27
SOT1917-5 WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body (backside coating included) 2019-07-04
SOT1926-1 WLCSP41 WLCSP41, wafer level chip-scale package; 41 bumps; 1.500 mm x 1.455 mm x 0.275 mm body 2017-06-14
SOT1942-1 WLCSP40 WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) 2017-09-13
SOT1950-1 WLCSP72 WLCSP72, wafer level chip-scale package, 72 bumps, 4.46 mm x 3.96 mm x 0.53 mm body 2017-10-05
SOT1957-1 WLCSP43 WLCSP43, wafer level chip-scale package; 43 bumps; 0.4 mm pitch, 4.045 mm x 3.16 mm x 0.38 mm body 2018-04-12
SOT1964-1 WLCSP8 WLCSP8, wafer level chip-scale package, 8 terminals, 0.205 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body 2018-03-07
SOT1966-1 WLCSP81 WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body 2018-02-12
SOT1966-2 WLCSP81 WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body (backside coating included) 2018-03-14
SOT1975-1 WLCSP68 WLCSP68, wafer level chip-scale package, 68 terminals; 0.35 mm pitch, 3.78 mm x 3.06 mm x 0.49 mm body (backside coating included) 2018-05-16
SOT1975-2 WLCSP68 WLCSP68, wafer level chip-scale package, 68 terminals; 0.35 mm pitch, 3.78 mm x 3.06 mm x 0.325 mm body (backside coating included) 2019-11-25
SOT1999-1 WLCSP12 WLCSP12, wafer level chip scale package; 12 terminals, 0.5 mm pitch, 2.06 mm x 2.018 mm x 0.6 mm body 2019-06-11
SOT2011-1 WLCSP36 WLCSP36, wafer level chip scale package, 36 terminals, 0.3 mm pitch, 1.895 mm x 1.895 mm x 0.38 mm body (backside coating included) 2019-02-25
SOT2019-1 WLCSP114 WLCSP114, wafer level chip scale package, 114 terminals, 0.35 mm pitch, 4.235 mm x 4.235 mm x 0.49 mm body (backside coating included) 2020-04-24
SOT2028-1 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 3.15 mm x 2.89 mm x 0.38 mm body 2021-05-28
SOT2033-1 WLCSP91 WLCSP91, wafer level chip scale package, 91 terminals with gold bump, 0.15 mm pitch, 4.425 mm x 4.06 mm x 0.263 mm body 2019-07-08
SOT2033-2 WLCSP91 WLCSP91, wafer level chip scale package, 91 terminals with gold bump, 0.15 mm pitch, 4.425 mm x 4.06 mm x 0.129 mm body 2019-07-08
SOT2034-1 WLCSP48 WLCSP48, wafer level chip scale package, 48 terminals with gold bump, 0.15 mm pitch, 3.931 mm x 2.983 mm x 0.129 mm body 2019-07-15
SOT2035-1 WLCSP12 WLCSP12, wafer level chip scale package, 12 terminals, 0.25 mm pitch, 1.185 mm x 0.935 mm x 0.22 mm body 2019-10-24
SOT2041-1 WLCSP4 WLCSP4, wafer level chip scale package, 4 terminals; 0.6 mm pitch; 1.015 mm x 1.015 mm x 0.38 mm body (backside coating included) 2019-08-09
SOT2042-1 WLCSP9 WLCSP9, wafer level chip scale package, 9 terminals; 0.3 mm pitch; 1.015 mm x 1.015 mm x 0.38 mm body (backside coating included) 2019-08-08
SOT2042-2 WLCSP9 WLCSP9, wafer level chip-size package, 9 terminals, 0.3 mm pitch, 0.92 mm x 0.92 mm x 0.38 mm body (backside coating included) 2022-04-28
SOT2057-1 WLCSP70 WLCSP70, wafer level chip scale package, 70 terminals, 0.4 mm pitch, 4.16 mm x 2.96 mm x 0.525 mm body (backside coating included) 2020-05-20
SOT2060-1 WLCSP49 WLCSP49, wafer level chip scale package, 49 terminals, 0.35 mm pitch, 2.56 mm x 2.46 mm x 0.365 mm body (backside coating included) 2020-04-20
SOT2063-1 WLCSP12 WLCSP12, wafer level chip scale package, 12 terminals, 0.35 mm pitch, 1.55 mm x 1.18 mm x 0.455 mm body (backside coating included) 2021-03-11
SOT2063-2 WLCSP12 WLCSP12, wafer level chip scale package, 12 terminals, 0.35 mm pitch, 1.545 mm x 1.26 mm x 0.495 mm body 2020-09-07
SOT2063-4 WLCSP12 WLCSP12, wafer level chip-size package, 12 terminals, 0.35 mm pitch, 1.405 mm x 1.055 mm x 0.49 mm body (backside coating included) 2024-07-03
SOT2069-1 WLCSP141 WLCSP141, wafer level chip scale package, 141 terminals, 0.35 mm pitch, 4.525 mm x 4.525 mm x 0.49 mm body (back side coating included) 2020-07-13
SOT2073-1 WLCSP76 WLCSP76, wafer level chip scale package, 76 terminals, 3.95 mm x 3.565 mm x 0.495 mm body (backside coating included) 2020-06-10
SOT2100-1 WLCSP83 WLCSP83, wafer level chip scale package, 83 terminals, 0.4 mm pitch, 4.6 mm x 4.2 mm x 0.75 mm body 2020-09-16
SOT2109-1 WLCSP74 WLCSP74, wafer level chip scale package, 74 terminals, 0.4 mm pitch, 3.46 mm x 4.675 mm x 0.76 mm body 2020-10-07
SOT2125-1 WLCSP79 WLCSP79, wafer level chip scale package, 79 terminals, 0.35 mm pitch, 3.58 mm x 3.185 mm x 0.37 mm body (backside coating included) 2021-03-31
SOT2126-1 WLCSP140 WLCSP140, wafer level chip-size package; 140 terminals; 0.3 mm pitch; 4.385 mm x 4.96 mm x 0.455 mm body 2022-01-13
SOT2127-1 WLCSP16 WLCSP16, wafer level chip scale package, 16 terminals, 0.35 mm pitch, 1.41 mm x 1.41 mm x 0.49 mm body (backside coating included) 2021-01-12
SOT2135-1 WLCSP103 WLCSP103, wafer level chip scale package, 103 terminals, 0.33 mm pitch, 4.05 mm x 3.16 mm x 0.38 mm body 2021-08-20
SOT2146-1 WLCSP70 WLCSP70, wafer level chip scale package, 70 terminals, 0.35 mm pitch, 3.64 mm x 3.16 mm x 0.49 mm body (backside coating included) 2021-06-01
SOT2152-1 WLCSP151 WLCSP151 wafer level chip-size package, 151 terminals, 0.3 mm pitch, 5.165 mm x 4.68 mm x 0.455 mm body (backside coating included) 2023-05-04
WLCSP WLCSP wafer level chip-size package; 5 bumps (2-1-2) 2007-05-25
WLCSP10_4-2-4 WLCSP wafer level chip-size package; 10 bumps (4-2-4) 2010-02-11
WLCSP15_6-3-6 WLCSP wafer level chip-size package; 15 bumps (6-3-6) 2010-02-11
WLCSP17_6-5-6 WLCSP wafer level chip-size package; 17 bumps (6-5-6) 2012-05-03
WLCSP25_217X232 WLCSP25 wafer level chip-size package; 25 bumps 2012-02-13
WLCSP25_5X5 WLCSP wafer level chip-size package; 25 bumps (5 x 5) 2010-02-11
WLCSP30 WLCSP30 wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2016-01-25
WLCSP4 WLCSP4 wafer level chip-scale package; 4 bumps; 0.83 x 0.78 x 0.53 mm (backside coating included) 2016-04-13
WLCSP5_2-1-2 WLCSP wafer level chip-size package; 5 bumps (2-1-2) 2010-02-11
WLCSP6 WLCSP wafer level chip-size package; 6 bumps 2012-01-11