SOT1782-3: WLCSP64

Overview

WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1782-3	WLCSP64	surface mount	bottom	WLCSP	3.24 x 3.24 x 0.625	64

Manufacture Code	Reference Codes	Issue Date
98ASA01270		2018-08-02