SOT1443-7: WLCSP30

Overview

wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1443-7	WLCSP30	surface mount	bottom	WLCSP	2.44 x 2.2 x 0.525	30

Manufacture Code	Reference Codes	Issue Date
98ASA01432D		2019-04-16