SOT1917-1: WLCSP72

Overview

WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 2.99 mm x 3.54 mm x 0.355 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1917-1	WLCSP72	surface mount	bottom	WLCSP	2.99 x 3.54 x 0.355	72

Manufacture Code	Reference Codes	Issue Date
98ASA01183D		2018-01-22