OL-TFA9897B: WLCSP

Overview

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-TFA9897B	WLCSP	surface mount	bottom	UC	2.06 x 2.72 x 0.525	30	plastic

Manufacture Code	Reference Codes	Issue Date
OL-TFA9897B		2015-03-13