OL-NX5P1100: WLCSP

Overview

WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-NX5P1100	WLCSP	surface mount	bottom	UC	1.66 x 1.36 x 0.51	12	other

Manufacture Code	Reference Codes	Issue Date
WLCSP12		2013-12-20