OL-TFA9981UK: WLCSP


Overview

Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.3 x 1.3 x 0.6 9 other
Manufacture Code Reference Codes Issue Date
WLCSP9 2010-10-25