OL-TFA9981UK: WLCSP

Overview

Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-TFA9981UK	WLCSP	surface mount	bottom	UC	1.3 x 1.3 x 0.6	9	other

Manufacture Code	Reference Codes	Issue Date
WLCSP9		2010-10-25