SOT1394-2: WLCSP16

Overview

wafer level chip-scale package; 16 bumps; 2.05 x 2.05 x 0.555 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1394-2	WLCSP16	surface mount	bottom	WLCSP	2.05 x 2.05 x 0.555	16	other

Manufacture Code	Reference Codes	Issue Date
SOT1394		2016-08-29

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