OL-NX3P1108: WLCSP

Overview

wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-NX3P1108	WLCSP	surface mount	bottom	UC	0.96 0.96 x 0.55	4	other

Manufacture Code	Reference Codes	Issue Date
WLCSP4	---(EIAJ);---(JEDEC);---(IEC	2012-07-02