SOT1890-1: WLCSP56

Overview

wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x 2.59 mm x 0.415 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1890-1	WLCSP56	surface mount	bottom	WLCSP	2.94 x 2.59 x 0.415	56

Manufacture Code	Reference Codes	Issue Date
SOT1890-1		2016-08-09