OL-IP4052CX20: WLCSP

Overview

Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.70 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4052CX20	WLCSP	surface mount	bottom	UC		20	other

Manufacture Code	Reference Codes	Issue Date
WLCSP20		2008-11-11