WLCSP30: WLCSP30

Overview

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
WLCSP30	WLCSP30	surface mount	bottom	WLCSP		30	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1443-1		2016-01-25