SOT2235-1: WLCSP114 Wafer Level Chip-size Package | NXP Semiconductors

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SOT2235-1: WLCSP114

Overview

WLCSP114, wafer level chip scale package, 114 terminals, 0.33 mm pitch, 4.495 mm x 4.0 mm x 0.455 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
 SOT2235-1 WLCSP114 surface mount upper WLCSP 4.495 x 4 x 0.455 114 silicon
Manufacture Code Reference Codes Issue Date
98ASA02158D 2024-12-02