OL-NX3P2902B: WLCSP

Overview

wafer level chip-scale package; 4 bumps; 0.77 x 0.77 x 0.51 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-NX3P2902B	WLCSP	surface mount	bottom	UC	0.77 x 0.77 x 0.51	4	other

Manufacture Code	Reference Codes	Issue Date
WLCSP4	---(EIAJ);---(JEDEC);---(IEC	2013-04-02

Products

Part	Description	Quick access
NX3P2902BUK	Logic controlled high-side power switch	View parametrics