SOT1380-1: WLCSP6


Overview

wafer level chip-scale package; 6 bumps; 0.69 mm x 1.09 mm x 0.38 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP6 surface mount bottom WLCSP 0.69 x 1.09 x 0.38 other
Manufacture Code Reference Codes Issue Date
SOT1380 2016-11-24
Part Description Quick access
Ultra low power, 1.8 V, 1 deg. C accuracy, digital temperature sensor with I2C-bus interface