SOT1401-1: WLCSP25

Overview

wafer level chip-scale package, 25 balls; 2.51 mm x 2.51 mm x 0.5 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1401-1	WLCSP25	surface mount	bottom	WLCSP	2.51 x 2.51 x 0.5	25

Manufacture Code	Reference Codes	Issue Date
SOT1401		2015-10-05

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