SOT1887-3: WLCSP48

Overview

WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1887-3	WLCSP48	surface mount	bottom	WLCSP	2.51 x 3.55 x 0.525	48

Manufacture Code	Reference Codes	Issue Date
98ASA01163D		2017-12-11