OL-IP4350CX24: WLCSP


Overview

Wafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4350CX24 WLCSP surface mount bottom UC 2.11 x 1.95 x 0.70 24 other
Manufacture Code Reference Codes Issue Date
WLCSP24 2011-06-06