OL-IP4060CX16: WLCSP

Overview

wafer level chip-size package; 16 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4060CX16	WLCSP	surface mount	bottom	UC	1.96 x 1.97 x 0.7	16	other

Manufacture Code	Reference Codes	Issue Date
WLCSP16		2009-03-12