SOT1966-2: WLCSP81

Overview

WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1966-2	WLCSP81	surface mount	bottom	WLCSP	3.55 x 3.36 x 0.365	81

Manufacture Code	Reference Codes	Issue Date
98ASA01227D		2018-03-14