OL-TFA9897: WLCSP

Overview

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-TFA9897	WLCSP	surface mount	bottom	UC	2.06 x 2.72 x 0.50 mm	30	other

Manufacture Code	Reference Codes	Issue Date
WLCSP30		2014-10-09