SOT1384-5: WLCSP9

Overview

wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1384-5	WLCSP9	surface mount	bottom	WLCSP	1.24 x 1.24 x 0.525

Manufacture Code	Reference Codes	Issue Date
SOT1384		2018-08-08