OL-IP4343CX5_LF: WLCSP

Overview

Wafer level chip-size package; 5 bumps; 0.93 x 0.93 x 0.66 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4343CX5_LF	WLCSP	surface mount	bottom	UC		5	other

Manufacture Code	Reference Codes	Issue Date
WLCSP5		2011-07-18