SOT1855-1: WLCSP

Overview

wafer level chip-scale package; 29 bumps; 1.14 x 1.14 x 0.28 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1855-1	WLCSP	surface mount	bottom	WLCSP	1.14 x 1.14 x 0.28	29	other

Manufacture Code	Reference Codes	Issue Date
SOT1855		2016-10-04