OL-IP4352CX24: WLCSP

Overview

Wafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4352CX24	WLCSP	surface mount	bottom	UC	2.01 x 2.02 x 0.61	24	other

Manufacture Code	Reference Codes	Issue Date
WLCSP24		2009-07-06