SOT1463-1: WLCSP

Overview

wafer level chip-scale package, 46 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1463-1	WLCSP	surface mount	bottom	WLCSP	1.80 x 1.14 x 0.28	46

Manufacture Code	Reference Codes	Issue Date
SOT1463		2016-03-02