SOT1833-1: WLCSP75

Overview

WLCSP75, wafer level chip-size package; 75 terminals; 0.4 mm pitch; 3.8 mm x 3.89 mm x 0.56 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1833-1	WLCSP75	surface mount	bottom	WLCSP	3.8 x 3.89 x 0.56	75

Manufacture Code	Reference Codes	Issue Date
98ASA00956		2017-06-11

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