SOT1444-4: WLCSP

Overview

wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1444-4	WLCSP	surface mount	bottom	UC	2.98 x 3.43 x 0.56	49	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1444		2015-07-21