OL-IP4067CX9: WLCSP

Overview

Wafer level chip-size package; 5 bumps; 1.46 x 1.52 x 0.70 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4067CX9	WLCSP	surface mount	bottom	WLCSP	1.46 x 1.52 x 0.70	9	other

Manufacture Code	Reference Codes	Issue Date
WLCSP9		2011-04-28