SOT1917-5: WLCSP72

Overview

WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1917-5	WLCSP72	surface mount	bottom	WLCSP	3.54 x 2.99 x 0.365	72

Manufacture Code	Reference Codes	Issue Date
98ASA01472D		2019-07-04