OL-IP3319CX6: WLCSP

Overview

Wafer level chip-size package; 6 bumps (2 x 3)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP3319CX6	WLCSP	surface mount	bottom	UC	0.95 x 1.34 x 0.6	6	other

Manufacture Code	Reference Codes	Issue Date
WLCSP6		2013-06-11