SOT1444-11: WLCSP49

Overview

WLCSP49, wafer level chip-scale package; 49 bumps; 3.3 mm x 3.3 mm x 0.525 mm body (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1444-11	WLCSP49	surface mount	bottom	WLCSP	3.3 x 3.3 x 0.525	49

Manufacture Code	Reference Codes	Issue Date
98ASA01205D		2018-08-22