SOT1780-4: WLCSP36

Overview

WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1780-4	WLCSP36	surface mount	bottom	WLCSP	2.62 x 2.51 x 0.525	36

Manufacture Code	Reference Codes	Issue Date
98ASA01158D		2017-12-20