SOT1448-1: WLCSP29

Overview

WLCSP29, wafer level chip-size package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1448-1	WLCSP29	surface mount	bottom	WLCSP	3.19 x 2.07 x 0.6	29

Manufacture Code	Reference Codes	Issue Date
SOT1448		2017-06-14