SOT1914-3: WLCSP56

Overview

WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 3.455 mm x 3.06 mm x 0.365 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1914-3	WLCSP56	surface mount	bottom	WLCSP	3.455 x 3.06 x 0.365	56

Manufacture Code	Reference Codes	Issue Date
98ASA01517D		2019-09-17