OL-IP4302CX2: WLCSP

Overview

Wafer level chip-size package; 2 bumps; 0.52 x 0.72 x 0.42 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4302CX2	WLCSP	surface mount	bottom	UC	0.52 x 0.72 x 0.42	2	other

Manufacture Code	Reference Codes	Issue Date
WLCSP2		2008-05-20