OL-IP4064CX8: WLCSP

Overview

Wafer level chip-size package; 8 bumps; 1.41 x 1.41 x 0.7 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4064CX8	WLCSP	surface mount	bottom	UC	1.41 x 1.41 x 0.7	8	other

Manufacture Code	Reference Codes	Issue Date
WLCSP8		2010-11-02