WLCSP17_6-5-6: WLCSP

Overview

wafer level chip-size package; 17 bumps (6-5-6)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
WLCSP17_6-5-6	WLCSP	surface mount	bottom	UC		17	other

Manufacture Code	Reference Codes	Issue Date
WLCSP17		2012-05-03