SOT1443-2: WLCSP

Overview

wafer level chip-scale package; 30 bumps; 2.26 x 2.56 x 0.51 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1443-2	WLCSP	surface mount	bottom	UC	2.26 x 2.56 x 0.51	30	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1443		2015-06-11

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