OL-IP4309CX9: WLCSP

Overview

Wafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4309CX9	WLCSP	surface mount	bottom	UC	1.16 x 1.16 x 0.66	9	other

Manufacture Code	Reference Codes	Issue Date
WLCSP9		2008-09-24