OL-IP3053CX20: WLCSP

Overview

Wafer level chip-size package; 20 bumps (8-4-8)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP3053CX20	WLCSP	surface mount	bottom	UC	3.96 x 1.28 x 0.65	20	other

Manufacture Code	Reference Codes	Issue Date
WLCSP20	---(EIAJ);---(JEDEC);---(IEC	2011-06-06