OL-PEMI8CSP_RW_P: WLCSP

Overview

Wafer level chip-size package; 20 bumps (8-4-8)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-PEMI8CSP_RW_P	WLCSP	surface mount	bottom	UC	3.16 x 1.05 x 0.61	20	other

Manufacture Code	Reference Codes	Issue Date
WLCSP20		2011-07-06