SOT1397-6: WLCSP20

Overview

WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1397-6	WLCSP20	surface mount	bottom	WLCSP	1.70 x 2.16 x 0.525	20

Manufacture Code	Reference Codes	Issue Date
SOT1397		2017-01-19

Products

Part	Description	Quick access
NX30P6093UK	30 V OVP, 100V Surge with moisture detection, 9mohm RDSON	View parametrics
NX30P6093AUK	High-Voltage I2C Controlled Overvoltage Protection Load Switch with OTG	View parametrics