SOT2033-1: WLCSP91


Overview

WLCSP91, wafer level chip scale package, 91 terminals with gold bump, 0.15 mm pitch, 4.425 mm x 4.06 mm x 0.263 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP91 surface mount bottom WLCSP 4.425 x 4.06 x 0.263 91
Manufacture Code Reference Codes Issue Date
98ASA01413D 2019-07-08