OL-IP4358CX6: WLCSP

Overview

Wafer level chip-size package; 6 bumps; 1.16 x 0.76 x 0.68 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4358CX6	WLCSP	surface mount	bottom	UC	1.16 x 0.76 x 0.68	6	other

Manufacture Code	Reference Codes	Issue Date
WLCSP6		2008-10-10