AFT05MP075N|70 W CW, 136-520 MHz, 12.5 V | NXP Semiconductors

136-520 MHz, 70 W, 12.5 V Broadband RF Power LDMOS Transistors

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Features

  • Characterized for Operation from 136 to 520 MHz
  • Unmatched Input and Output Allowing Wide Frequency Range Utilization
  • Integrated ESD Protection
  • Integrated Stability Enhancements
  • Wideband — Full Power Across the Band
  • Exceptional Thermal Performance
  • Extreme Ruggedness
  • High Linearity for: TETRA, SSB, LTE
  • RoHS Compliant
  • In Tape and Reel. R1 Suffix = 500 Units, 44 mm Tape Width, 13-inch Reel.
  • Output Stage VHF Band Mobile Radio
  • Output Stage UHF Band Mobile Radio

RF Performance Tables

Typical Performance

12.5 V, TA = 25°C, CW

Ruggedness

Buy/Parametrics

2 results

Exclude 2 NRND

Order

CAD Model

Status

Not Recommended for New Designs

Not Recommended for New Designs

N true 0 PSPAFT05MP075Nen 8 Application Note Application Note t789 3 Data Sheet Data Sheet t520 1 Package Information Package Information t790 2 Supporting Information Supporting Information t531 1 White Paper White Paper t530 1 en_US en_US en Data Sheet Data Sheet 1 1 1 English AFT05MP075N and AFT05MP075GN are designed for mobile two-way radio applications with frequencies from 136 to 520 MHz. The high gain, ruggedness and broadband performance of these devices make them ideal for large-signal, common source amplifier applications in mobile radio equipment. 1360356457780702938806 PSP 1.0 MB None None documents None 1360356457780702938806 /docs/en/data-sheet/AFT05MP075N.pdf 1007951 /docs/en/data-sheet/AFT05MP075N.pdf AFT05MP075N documents N N 2016-10-31 AFT05MP075NR1, AFT05MP075GNR1 136-520 MHz, 70 W AVG., 12.5 V Broadband RF Power LDMOS Transistors - Data Sheet /docs/en/data-sheet/AFT05MP075N.pdf /docs/en/data-sheet/AFT05MP075N.pdf Data Sheet N 980000996212993340 2022-12-07 pdf N en Aug 14, 2014 980000996212993340 Data Sheet Y N AFT05MP075NR1, AFT05MP075GNR1 136-520 MHz, 70 W AVG., 12.5 V Broadband RF Power LDMOS Transistors - Data Sheet Application Note Application Note 3 2 2 English This document explains the methodology used by NXP for thermal characterization of RF high power amplifier products, which include LDMOS and GaN active devices. 1075398872032723970051 PSP 235.5 KB None None documents None 1075398872032723970051 /docs/en/application-note/AN1955.pdf 235468 /docs/en/application-note/AN1955.pdf AN1955 documents N N 2016-11-09 Thermal Characterization Methodology of RF Power Amplifiers - Application Note /docs/en/application-note/AN1955.pdf /docs/en/application-note/AN1955.pdf Application Note N 645036621402383989 2025-01-28 pdf N en Jul 11, 2024 645036621402383989 Application Note Y N Thermal Characterization Methodology of RF Power Amplifiers - Application Note 3 3 English I989356375600 PSP 910.7 KB None None documents None I989356375600 /docs/en/application-note/AN1907.pdf 910737 /docs/en/application-note/AN1907.pdf AN1907 documents N N 2016-11-09 AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages /docs/en/application-note/AN1907.pdf /docs/en/application-note/AN1907.pdf Application Note N 645036621402383989 2025-01-28 pdf N en May 13, 2009 645036621402383989 Application Note Y N AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages 4 0 English This application note provides NXP Semiconductors customers with a guide for mounting high power RF transistors and integrated circuits in Over-Molded Plastic (OMP) packages by clamping down the RF power device in the Power Amplifier (PA) housing. 1236894638615715664840 PSP 449.7 KB None None documents None 1236894638615715664840 /docs/en/application-note/AN3789.pdf 449688 /docs/en/application-note/AN3789.pdf AN3789 documents N N 2016-10-31 Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3789.pdf /docs/en/application-note/AN3789.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Mar 12, 2009 645036621402383989 Application Note Y N Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages Package Information Package Information 2 5 E English 98ASA10578D, 1487-05, TO-270 4 LEAD, Wide Body Gull Wing 117Dp21m PSP 75.2 KB None None documents None 117Dp21m /docs/en/package-information/98ASA10578D.pdf 75249 /docs/en/package-information/98ASA10578D.pdf SOT1736-2 documents N N 2016-10-31 98ASA10578D, TO, 17.0x9.0x2.59, Pitch 0.21, 4 Pins /docs/en/package-information/98ASA10578D.pdf /docs/en/package-information/98ASA10578D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Mar 17, 2016 302435339416912908 Package Information D N 98ASA10578D, TO, 17.0x9.0x2.59, Pitch 0.21, 4 Pins 6 F English 98ASA10577D, 1486-03, TO-270, 4 Lead 117Dnwyr PSP 75.9 KB None None documents None 117Dnwyr /docs/en/package-information/98ASA10577D.pdf 75944 /docs/en/package-information/98ASA10577D.pdf SOT1736-1 documents N N 2016-10-31 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins /docs/en/package-information/98ASA10577D.pdf /docs/en/package-information/98ASA10577D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Jan 18, 2016 302435339416912908 Package Information D N 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins Supporting Information Supporting Information 1 7 0 English Land Mobile Airfast<sup>&#174;</sup> products: AFT05MS031N and AFT09MS031N 1340065802618738876669 PSP 877.8 KB None None documents None 1340065802618738876669 /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf 877821 /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf LANDMOBILE_TRN_SI documents N N 2016-10-31 New Generation of Land Mobile Radio Products /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf Supporting Information N 371282830530968666 2022-12-07 pdf N en Jun 15, 2012 371282830530968666 Supporting Information Y N New Generation of Land Mobile Radio Products White Paper White Paper 1 8 2 English Describes main benefits of RF power plastic packages and recommendations on PCB layout, mounting and soldering techniques for designs using plastic RF PAs. 1415247676533716175304 PSP 911.8 KB None None documents None 1415247676533716175304 /docs/en/white-paper/RFPLASTICWP.pdf 911768 /docs/en/white-paper/RFPLASTICWP.pdf RFPLASTICWP documents N N 2016-10-31 Designing with Plastic RF Power Transistors White Paper /docs/en/white-paper/RFPLASTICWP.pdf /docs/en/white-paper/RFPLASTICWP.pdf White Paper N 918633085541740938 2024-03-13 pdf N en Sep 24, 2015 918633085541740938 White Paper Y N Designing with Plastic RF Power Transistors White Paper false 0 AFT05MP075N downloads en true 1 Y PSP Application Note 3 /docs/en/application-note/AN1955.pdf 2016-11-09 1075398872032723970051 PSP 2 Jul 11, 2024 Application Note This document explains the methodology used by NXP for thermal characterization of RF high power amplifier products, which include LDMOS and GaN active devices. None /docs/en/application-note/AN1955.pdf English documents 235468 None 645036621402383989 2025-01-28 N /docs/en/application-note/AN1955.pdf Thermal Characterization Methodology of RF Power Amplifiers - Application Note /docs/en/application-note/AN1955.pdf documents 645036621402383989 Application Note N en None Y pdf 2 N N Thermal Characterization Methodology of RF Power Amplifiers - Application Note 235.5 KB AN1955 N 1075398872032723970051 /docs/en/application-note/AN1907.pdf 2016-11-09 I989356375600 PSP 3 May 13, 2009 Application Note None /docs/en/application-note/AN1907.pdf English documents 910737 None 645036621402383989 2025-01-28 N /docs/en/application-note/AN1907.pdf AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages /docs/en/application-note/AN1907.pdf documents 645036621402383989 Application Note N en None Y pdf 3 N N AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages 910.7 KB AN1907 N I989356375600 /docs/en/application-note/AN3789.pdf 2016-10-31 1236894638615715664840 PSP 4 Mar 12, 2009 Application Note This application note provides NXP Semiconductors customers with a guide for mounting high power RF transistors and integrated circuits in Over-Molded Plastic (OMP) packages by clamping down the RF power device in the Power Amplifier (PA) housing. None /docs/en/application-note/AN3789.pdf English documents 449688 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN3789.pdf Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3789.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages 449.7 KB AN3789 N 1236894638615715664840 Data Sheet 1 /docs/en/data-sheet/AFT05MP075N.pdf 2016-10-31 1360356457780702938806 PSP 1 Aug 14, 2014 Data Sheet AFT05MP075N and AFT05MP075GN are designed for mobile two-way radio applications with frequencies from 136 to 520 MHz. The high gain, ruggedness and broadband performance of these devices make them ideal for large-signal, common source amplifier applications in mobile radio equipment. None /docs/en/data-sheet/AFT05MP075N.pdf English documents 1007951 None 980000996212993340 2022-12-07 N /docs/en/data-sheet/AFT05MP075N.pdf AFT05MP075NR1, AFT05MP075GNR1 136-520 MHz, 70 W AVG., 12.5 V Broadband RF Power LDMOS Transistors - Data Sheet /docs/en/data-sheet/AFT05MP075N.pdf documents 980000996212993340 Data Sheet N en None Y pdf 1 N N AFT05MP075NR1, AFT05MP075GNR1 136-520 MHz, 70 W AVG., 12.5 V Broadband RF Power LDMOS Transistors - Data Sheet 1.0 MB AFT05MP075N N 1360356457780702938806 Package Information 2 /docs/en/package-information/98ASA10578D.pdf 2016-10-31 117Dp21m PSP 5 Mar 17, 2016 Package Information 98ASA10578D, 1487-05, TO-270 4 LEAD, Wide Body Gull Wing None /docs/en/package-information/98ASA10578D.pdf English documents 75249 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10578D.pdf 98ASA10578D, TO, 17.0x9.0x2.59, Pitch 0.21, 4 Pins /docs/en/package-information/98ASA10578D.pdf documents 302435339416912908 Package Information N en None D pdf E N N 98ASA10578D, TO, 17.0x9.0x2.59, Pitch 0.21, 4 Pins 75.2 KB SOT1736-2 N 117Dp21m /docs/en/package-information/98ASA10577D.pdf 2016-10-31 117Dnwyr PSP 6 Jan 18, 2016 Package Information 98ASA10577D, 1486-03, TO-270, 4 Lead None /docs/en/package-information/98ASA10577D.pdf English documents 75944 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10577D.pdf 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins /docs/en/package-information/98ASA10577D.pdf documents 302435339416912908 Package Information N en None D pdf F N N 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins 75.9 KB SOT1736-1 N 117Dnwyr Supporting Information 1 /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf 2016-10-31 1340065802618738876669 PSP 7 Jun 15, 2012 Supporting Information Land Mobile Airfast<sup>&#174;</sup> products: AFT05MS031N and AFT09MS031N None /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf English documents 877821 None 371282830530968666 2022-12-07 N /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf New Generation of Land Mobile Radio Products /docs/en/supporting-information/LANDMOBILE_TRN_SI.pdf documents 371282830530968666 Supporting Information N en None Y pdf 0 N N New Generation of Land Mobile Radio Products 877.8 KB LANDMOBILE_TRN_SI N 1340065802618738876669 White Paper 1 /docs/en/white-paper/RFPLASTICWP.pdf 2016-10-31 1415247676533716175304 PSP 8 Sep 24, 2015 White Paper Describes main benefits of RF power plastic packages and recommendations on PCB layout, mounting and soldering techniques for designs using plastic RF PAs. None /docs/en/white-paper/RFPLASTICWP.pdf English documents 911768 None 918633085541740938 2024-03-13 N /docs/en/white-paper/RFPLASTICWP.pdf Designing with Plastic RF Power Transistors White Paper /docs/en/white-paper/RFPLASTICWP.pdf documents 918633085541740938 White Paper N en None Y pdf 2 N N Designing with Plastic RF Power Transistors White Paper 911.8 KB RFPLASTICWP N 1415247676533716175304 true Y Products

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Data Sheet (1)
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