Find mechanical outline drawings and related information.
| Package Version | Package Name | Package Description | Reference Codes | Issue Date |
|---|---|---|---|---|
| SOT1035-1 | HBGA736 | plastic thermal enhanced ball grid array package; 736 balls; heatsink | 2009-08-14 | |
| SOT1088-1 | HBGA520 | plastic thermal enhanced ball grid array package; 520 balls; heatsink | MS-034(JEDEC);144E(IEC | 2008-06-03 |
| SOT1095-1 | HBGA624 | plastic thermal enhanced ball grid array package; 624 balls; heatsink, 1 mm pitch, 35 mm x 35 mm x1.75 mm body | 2008-11-17 | |
| SOT1119-1 | HBGA432 | plastic thermal enhanced ball grid array package; 432 balls; heatsink | MS-034(JEDEC);144E(IEC | 2009-08-14 |
| SOT1123-1 | HBGA324 | plastic thermal enhanced ball grid array package; 324 balls; heatsink | MS-034(JEDEC);144E(IEC | 2009-06-09 |
| SOT1123-2 | HBGA324 | plastic thermal enhanced ball grid array package; 324 balls; heatsink | MS-034(JEDEC);144E(IEC | 2010-01-06 |
| SOT1142-1 | HBGA543 | plastic thermal enhanced ball grid array package; 543 balls; heatsink, 1 mm pitch, 27 mm x 27 mm x 1.73 mm body | 2009-08-03 | |
| SOT1148-1 | HBGA404 | HBGA404, plastic thermal enhanced ball grid array; 404 balls; 1 mm pitch, 23 mm x 23 mm x 1.75 mm body | MS-034(JEDEC);144E(IEC | 2017-06-14 |
| SOT1151-1 | HBGA640 | plastic thermal enhanced ball grid array package; 640 balls; heatsink | MS-034D compliant(JEDEC | 2009-10-19 |
| SOT1163-1 | HBGA360 | plastic, thermal enhanced ball grid array package; 360 balls; heatsink | MS-034(JEDEC);144E(IEC | 2010-01-22 |
| SOT1627-1 | HBGA620 | HBGA620, plastic, thermal enhanced ball grid array; 620 balls; 1 mm pitch; 29 mm x 29 mm x 2.46 mm body | MS-034 AAM-1(JEDEC | 2016-02-01 |
| SOT1659-1 | HBGA448 | HBGA448, plastic, thermal enhanced ball grid array; 448 balls; 1 mm pitch; 23 mm x 23 mm x 1.93 mm body | 2017-06-11 | |
| SOT1665-1 | HBGA516 | HBGA516, plastic, thermal enhanced ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 2.55 mm body | PBGA-B516(JEDEC | 2017-06-11 |
| SOT1744-1 | HBGA668 | HBGA668, plastic, thermal enhanced ball grid array; 668 balls; 1 mm pitch; 29 mm x 29 mm x 1.8 mm body | HT-PBGA-B668(JEDEC | 2017-06-11 |
| SOT1745-1 | HBGA689 | HBGA689, plastic, thermal enhanced ball grid array; 689 balls; 1 mm pitch; 31 mm x 31 mm x 1.86 mm body | HT-PBGA-B689(JEDEC | 2017-06-11 |
| SOT546-2 | HBGA352 | plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm | 2000-03-04 | |
| SOT553-1 | HBGA292 | plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2002-02-27 |
| SOT602-1 | HBGA256 | plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink | MS-034(JEDEC);144E(IEC | 2003-03-17 |
| SOT603-1 | HBGA420 | plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink | MS-034(JEDEC);144E(IEC | 2003-03-17 |
| SOT604-1 | HBGA504 | plastic, thermal enhanced ball grid array package; 504 balls; 1.27 mm pitch; 35 mm x 35 mm x 0.9 mm body | MS-034(JEDEC);144E(IEC | 2003-03-17 |
| SOT605-1 | HBGA600 | plastic, thermal enhanced ball grid array package; 600 balls; 1.27 mm pitch; 40 mm x 40 mm x 0.9 mm body | MS-034(JEDEC);144E(IEC | 2003-03-17 |
| SOT610-1 | HBGA456 | plastic thermal enhanced ball grid array package; 456 balls; body 35 x 35 x 1.8 mm; heatsink | MS-034(JEDEC);144E(IEC | 2009-08-14 |
| SOT624-1 | HBGA1312 | plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink | MS-034(JEDEC);144E(IEC | 2003-01-14 |
| SOT635-1 | HBGA596 | plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2003-01-14 |
| SOT636-1 | HBGA388 | plastic, heatsink ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body | MS-034(JEDEC);144E(IEC | 2001-12-11 |
| SOT683-1 | HBGA960 | plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink | MS-034(JEDEC | 2002-05-01 |
| SOT706-1 | HBGA552 | plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink | 2002-11-13 | |
| SOT707-1 | HBGA584 | plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink | 2002-11-22 | |
| SOT714-1 | HBGA329 | plastic thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2001-10-30 |
| SOT799-1 | HBGA564 | plastic thermal enhanced ball grid array package; 564 balls; body 40 x 40 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2002-11-18 |
| SOT807-1 | HBGA156 | plastic thermal enhanced ball grid array package; 156 balls; body 15 x 15 x 1.15 mm; heatsink | MS-034(JEDEC | 2003-03-06 |
| SOT835-1 | HBGA672 | plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink | 2003-11-18 | |
| SOT846-1 | HBGA760 | plastic thermal enhanced ball grid array package; 760 balls; body 40 x 40 x 1.75 mm; heatsink | MS-034(JEDEC | 2005-08-19 |
| SOT850-1 | HBGA256 | plastic thermal enhanced ball grid array package; 256 balls; body 17 x 17 x 1.4 mm; heatsink | MS-034(JEDEC | 2004-03-19 |
| SOT860-1 | HBGA624 | plastic, thermal enhanced ball grid array package; 624 balls; 1.27 mm pitch; 40 mm x 40 mm x 1.75 mm body | MS-034(JEDEC | 2005-09-22 |
| SOT900-1 | HBGA456 | plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2005-09-02 |
| SOT948-1 | HBGA1092 | plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2006-05-31 |
| SOT953-1 | HBGA432 | plastic thermal enhanced ball grid array package; 432 balls; body 35 x 35 x 1.75 mm; heatsink | MS-034(JEDEC);144E(IEC | 2006-06-21 |
