SOT900-1: HBGA456

Overview

plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT900-1	HBGA456	surface mount	bottom	HBGA		456	plastic

Manufacture Code	Reference Codes	Issue Date
SOT900	MS-034(JEDEC);144E(IEC	2005-09-02

Products

Part	Description	Quick access
PNX1702EH	Connected media processor	View parametrics
PNX1701EH	Connected media processor	View parametrics
PNX1700EH	Connected media processor	View parametrics