SOT1665-1: HBGA516


Overview

HBGA516, plastic, thermal enhanced ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 2.55 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA516 surface mount bottom HBGA 27 x 27 x 2.55 516 plastic
Manufacture Code Reference Codes Issue Date
98ASA10789D PBGA-B516(JEDEC 2017-06-11
Part Description Quick access
TELEMATICS PROCESSOR
PowerQUICC, 32 Bit Power Architecture SoC, 400MHz, DDR1/2, PCI, GbE, USB, 0 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 333MHz, DDR1/2, PCI, GbE, USB, -40 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz, DDR1/2, PCI, GbE, USB, -40 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz, DDR1/2, PCI, GbE, USB, 0 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 333MHz, DDR1/2, PCI, GbE, USB, 0 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 400MHz, DDR1/2, PCI, GbE, USB, -40 to 105C, Rev 3
8313 NOPB PBGA W/ ENCR
PowerQUICC, 32 Bit Power Architecture SoC, 333MHz, DDR1/2, PCI, GbE, USB, -40 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 333MHz, DDR1/2, PCI, GbE, USB, SEC, 0 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz, DDR1/2, PCI, GbE, USB, SEC, 0 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz, DDR1/2, PCI, GbE, USB, SEC, -40 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 333MHz, DDR1/2, PCI, GbE, USB, SEC, -40 to 105C, Rev 3
PowerQUICC, 32 Bit Power Architecture SoC, 400MHz, DDR1/2, PCI, GbE, USB, SEC, -40 to 105C, Rev 3
TELEMATICS PROCESSOR W/O MBX GRAPHICS
PowerQUICC, 32 Bit Power Architecture SoC, 400MHz, DDR1/2, PCI, GbE, USB, SEC, 0 to 105C, Rev 3