SOT835-1: HBGA672

Overview

plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT835-1	HBGA672	surface mount	bottom	HBGA		672	plastic

Manufacture Code	Reference Codes	Issue Date
SOT835		2003-11-18